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<version>v8.0</version>
<date>2026-05-29 19:54:31</date>
<action>I</action>
<registdate>2026-05-29 18:28:03</registdate>
<modifydate>2026-05-29 19:53:32</modifydate>
<publishdate>2026-05-29 19:53:57</publishdate>
<embargo>N</embargo>
<newsid>815006</newsid>
<orgid>814946</orgid>
<language>CN</language>
<category1>11</category1>
<category2>1102</category2>
<category1_name>IT/과학</category1_name>
<category2_name>컴퓨팅/디바이스</category2_name>
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<newsSubject><![CDATA[三星电子完成HBM4E量产布局 首批12层样品正式出货]]></newsSubject>
<newsSummary><![CDATA[]]></newsSummary>
<newsTag><![CDATA[HBM4E,AI메모리,고대역폭메모리]]></newsTag>
<newsLinks><![CDATA[]]></newsLinks>
<news_prolog><![CDATA[(Seoul=NSP NEWS) =]]></news_prolog>
<news1><![CDATA[三星电子向全球客户首次供应12层HBM4E样品，进一步加快下一代AI存储器市场布局。此次样品出货是继今年2月HBM4量产启动后的又一重要进展。

HBM4E产品采用10纳米级第六代（1c）DRAM和4纳米逻辑芯片，兼顾工艺稳定性与量产能力。产品运行速度达到每引脚14Gbps，最高可提升至16Gbps，单堆叠带宽达到每秒3.6TB。12层产品容量为48GB，未来还将推出32GB的8层产品和64GB的16层产品，进一步丰富产品线。

在封装设计方面，新产品较前代实现16%的能效提升和14%以上的散热性能改善，有助于满足高性能AI计算环境对功耗和散热的需求。三星电子表示，将以此次样品供应为起点，根据客户验证进度推进量产供应。

公司还将依托存储器、晶圆代工、系统LSI及先进封装的一站式解决方案，进一步提升AI存储器市场竞争力，并积极抢占下一代HBM市场先机。]]></news1>
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<news_epilog_info><![CDATA[]]></news_epilog_info>
<news_epilog_byline><![CDATA[By Jiwon Lee(won2514@nspna.com) and Bok-hyun Lee(bhlee2016@nspna.com)]]></news_epilog_byline>
<news_epilog><![CDATA[ⓒNSP News Agency·NSP TV. All rights reserved.]]></news_epilog>
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<advertorial><![CDATA[]]></advertorial>
<location><![CDATA[Seoul]]></location>
<teamID>110</teamID>
<teamName><![CDATA[국제부]]></teamName>
<writerID>won2514</writerID>
<writerName><![CDATA[Jiwon Lee]]></writerName>
<writerTitle><![CDATA[Reporter]]></writerTitle>
<writerEmail><![CDATA[won2514@nspna.com]]></writerEmail>
<writerID2>bhlee2016</writerID2>
<writerName2><![CDATA[Bok-hyun Lee]]></writerName2>
<writerTitle2><![CDATA[Reporter]]></writerTitle2>
<writerEmail2><![CDATA[bhlee2016@nspna.com]]></writerEmail2>
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