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<version>v8.0</version>
<date>2024-08-06 14:06:56</date>
<action>I</action>
<registdate>2024-08-06 11:35:45</registdate>
<modifydate>2024-08-06 14:06:34</modifydate>
<publishdate>2024-08-06 14:06:52</publishdate>
<embargo>N</embargo>
<newsid>711715</newsid>
<orgid>711681</orgid>
<language>CN</language>
<category1>20</category1>
<category2>2003</category2>
<category1_name>기업</category1_name>
<category2_name>가전/기기</category2_name>
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<newsSubject><![CDATA[三星电子，量产0.65毫米LPDDR5X DRAM]]></newsSubject>
<newsSummary><![CDATA[]]></newsSummary>
<newsTag><![CDATA[삼성전자(005930)]]></newsTag>
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<news_prolog><![CDATA[(Seoul=NSP NEWS AGENCY) =]]></news_prolog>
<news1><![CDATA[三星电子开始量产业界最薄的12纳米级LPDDR5X DRAM12·16GB（千兆字节）封装。

该产品厚度为0.65毫米，是现有12GB以上低功耗（LPDDR）DRAM中最薄的一款产品。产品厚度变得更薄，可以确保额外的空间，这有望改善移动设备的内部温度控制。

三星电子采用业界最薄的12纳米级LPDDR DRAM、利用4层堆叠技术、封装电路板与EMC（环氧塑封料）技术等技术优化，厚度比上一代产品减少了约9%，热阻提高了大约21.2%。

三星电子计划开发采用最薄LPDDR DRAM封装的6层结构24GB和8层结构32GB模块，并继续提供针对大模型端侧部署（On-Device AI）时代客户需求的优化解决方案。]]></news1>
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<news_epilog_byline><![CDATA[By Linfeng Hong(lf_69@nspna.com) and Jeonghwa Choi(choijh@nspna.com)]]></news_epilog_byline>
<news_epilog><![CDATA[ⓒNSP News Agency·NSP TV. All rights reserved. Prohibits using to train AI models.]]></news_epilog>
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<image1_source><![CDATA[Photo = 三星电子]]></image1_source>
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<location><![CDATA[Seoul]]></location>
<teamID>110</teamID>
<teamName><![CDATA[국제부]]></teamName>
<writerID>lf_69</writerID>
<writerName><![CDATA[Linfeng Hong]]></writerName>
<writerTitle><![CDATA[Reporter]]></writerTitle>
<writerEmail><![CDATA[lf_69@nspna.com]]></writerEmail>
<writerID2>choijh</writerID2>
<writerName2><![CDATA[Jeonghwa Choi]]></writerName2>
<writerTitle2><![CDATA[Reporter]]></writerTitle2>
<writerEmail2><![CDATA[choijh@nspna.com]]></writerEmail2>
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