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<nspnews type="text">
<version>v8.0</version>
<date>2023-06-09 08:38:05</date>
<action>I</action>
<registdate>2023-06-08 21:46:59</registdate>
<modifydate>2023-06-08 21:49:32</modifydate>
<publishdate>2023-06-09 08:37:59</publishdate>
<embargo>N</embargo>
<newsid>641605</newsid>
<orgid>641507</orgid>
<language>EN</language>
<category1>20</category1>
<category2>2001</category2>
<category1_name>기업</category1_name>
<category2_name>중기/벤처/기타</category2_name>
<statusID>1</statusID>
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<typeID>7</typeID>
<newsSubject><![CDATA[SK Hynix, Beginning Mass Production of 238-Layer 4D NAND]]></newsSubject>
<newsSummary><![CDATA[]]></newsSummary>
<newsTag><![CDATA[SKHynix,238layerNAND,MassProduction]]></newsTag>
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<news_prolog><![CDATA[(Seoul=NSP NEWS) =]]></news_prolog>
<news1><![CDATA[SK Hynix announced that it has started mass production of 238-layer 4D NAND flash and is in the process of product certification with overseas customers that produce smartphones.

“Based on 238-layer NAND, we developed cSSD(Client SSD) solution products for smartphones and PCs and started mass production in May,” said SK Hynix, “We expect these products to serve as a driving force to improve the company’s management performance in the second half of the year as we have secured world-class competitiveness in terms of cost, performance, and quality in 238-layer as well as the existing 176-layer.”

The 238-layer NAND, implemented with the world’s smallest chip, is 34% more efficient than the previous generation’s 176-layer, significantly improving cost competitiveness. The data transmission speed is 2.4Gb(gigabit) per second, which is 50% faster than the previous generation. Reading and writing performance is also improved by about 20%, and the company is confident that it will be able to provide improved performance to smartphone and PC customers using this product.

SK Hynix will supply 238-layer NAND starting with mobile products after completing certification of smartphone customers. Afterwards, it plans to expand the scope of application of 238-layer NAND to include SSDs for PCs that support PCIe 5.0 and high-capacity SSDs for data centers.]]></news1>
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<news_epilog_byline><![CDATA[By Soon-ki Lee(s8789@nspna.com) and Bok-hyun Lee(bhlee2016@nspna.com)]]></news_epilog_byline>
<news_epilog><![CDATA[ⓒNSP News Agency·NSP TV. All rights reserved.]]></news_epilog>
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<location><![CDATA[Seoul]]></location>
<teamID>110</teamID>
<teamName><![CDATA[국제부]]></teamName>
<writerID>s8789</writerID>
<writerName><![CDATA[Soon-ki Lee]]></writerName>
<writerTitle><![CDATA[Reporter]]></writerTitle>
<writerEmail><![CDATA[s8789@nspna.com]]></writerEmail>
<writerID2>bhlee2016</writerID2>
<writerName2><![CDATA[Bok-hyun Lee]]></writerName2>
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<writerEmail2><![CDATA[bhlee2016@nspna.com]]></writerEmail2>
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